Test method: Electronic assemblies and components

Visual inspection is an important step in the quality assurance of electronic components. It is typically performed by carefully inspecting components for external damage or deviations from specifications. This typically involves the use of a stereo or microscope to detect small deviations and defects that are not visible to the naked eye.

Typical examinations: Solder joints, damage, missing pins, misalignment or dirt particles.

Your Expert:
Florian Kronpass
+49 8106 9941 29
florian.kronpass@gwp.eu

X-ray inspection or computed tomography (CT) is an important method for non-destructive testing of electronic components. In particular, CT is used for encapsulated or complex components such as microcontrollers or chips, where a precise analysis of the internal structure is required.

CT works with X-rays that are sent through the component. Based on the absorption and scattering of the X-rays, a three-dimensional image of the internal structure of the component is created. This image can be used, for example, to identify impurities, material defects or damage inside the component.

Computed tomography offers high resolution and is able to make visible even the smallest structures inside the component. This makes it possible, for example, to detect cracks in conductive tracks or defectively processed materials. The method also enables the analysis of components that are difficult to access due to their size or design.

Ihr Experte:
Florian Kronpass
+49 8106 9941 29
florian.kronpass@gwp.eu

Environmental simulation is an important step in the quality assurance of electronic components. It simulates the different climatic conditions to which the components may be exposed to ensure that they function properly under various conditions.

An environmental simulation typically includes a combination of temperature, humidity, vibration and shock tests. These tests can be performed in a special test chamber that simulates climatic conditions or through the use of specialized test equipment.

Another important part of environmental simulation is testing resistance to corrosive substances such as salt water or chemicals. Exposure to these substances can be used to test whether the component is resistant enough to be used in environments where it could be exposed to such substances.

In addition, we offer fire testing.

Your Expert:
Dr. Ulrike Rantzsch
+49 341 392981 68
ulrike.rantzsch@gwp.eu

Scanning electron microscopy (SEM) is a powerful method for examining semiconductors, chips, and other devices at the microscopic level.

SEM works by using a beam of electrons directed at the sample. When the electron beam strikes the sample, a backscattered radiation is produced that is collected by a detector. From the analysis of this backscattered radiation, information can be obtained about the structure, surface and composition of the material.

At ChipCheck, the SEM is used to examine wafers, chips and other semiconductor devices. SEM can be used to detect material defects such as inclusions, cracks and impurities that can affect device performance. In addition, SEM enables the examination of surface structures and the identification of impurities or evaluation of fracture structures.

Micrographs (materialography) enable assessments inside components. For example

• Geometry of the solder filling
• Wetting angle between the solder filling and the surfaces of the joining partners
• Thickness of the intermetallic zones
• Condition of the intermetallic zone
• Intermetallic phases in the brazing structure
• Defects, voids, cracks
• or the structure of the solder filling (dendritic solidification of microstructural constituents, grain size).

characterize.

Your Expert:
Florian Kronpass
+49 8106 9941 29
florian.kronpass@gwp.eu

For boards, cables, connectors, pins, soldering, switches,….

• Tensile strength test
• Shear strength test
• Drop test
• Cyclic bending test
• Mechanical shear fatigue testing

are the typical tests used to evaluate mechanical strength.

Your Expert:
Kristina Trenz
+49 8106 994154
kristina.trenz@gwp.eu